Semiconductor
Cleaning.

Ultra-precision cleaning applications in high-end semiconductor manufacturing.

Critical Standards

Industry Requirements.

The semiconductor industry requires ultra-pure water for cleaning processes to ensure the highest quality and reliability of electronic components. Ionized water provides a precision, chemical-free solution.

Ultra-Pure Water

Zero contaminants, ensuring immaculate wafer surfaces without micro-debris.

Precise pH Control

Consistent cleaning performance customized for unique manufacturing thresholds.

Chemical-Free

No residual deposition left behind, lowering expenditure and environmental impact.

Process 01

Wafer Cleaning

  • Pre-Processing: Initial wafer preparation and stripping
  • Post-Processing: Final stage microscopic cleaning steps
  • Contaminant Removal: Absolute extraction of organic and inorganic particles
  • Surface Preparation: Optimized atomic surface conditions
Process 02

Equipment Sterilization

  • Chamber Cleaning: Intense vacuum process chamber maintenance
  • Tool Cleaning: Decontaminating macroscopic manufacturing equipment
  • Component Cleaning: Micro-level individual parts and assemblies
  • Preventive Maintenance: Baseline sterility protocols
Applied Properties

Ionized Water Specifications.

Alkaline Water (pH 8-10)

  • Organic Removal: Highly effective at stripping complex organic carbon contaminants.
  • Particle Suspension: Creates repulsive forces to keep micro-particles in suspension away from wafers.
  • Surface Activation: Atomically prepares silicon surfaces for subsequent deposition processing.
  • Precision Rinsing: Executed as a final ultra-pure rinse to eliminate cleaning agent residues.

Acidic Water (pH 4-6)

  • Inorganic Removal: Extremely capable of dissolving and removing metallic ion contamination.
  • Complete Disinfection: Total microbial and biological contamination control in water lines.
  • Oxide Layer Removal: Effectively strips native oxide layers without aggressive hydrofluoric acid.
  • Micro-Etching: Enables highly controlled and minimal surface modification at the sub-nano scale.

Advantages & Integration

Environmental

  • • Reduced toxic chemical usage
  • • Near-zero hazardous waste generation
  • • Infinite sustainable life-cycle support

Economic

  • • Drastically lowered operating costs
  • • Removed reliance on high-cost chemical reagents
  • • Streamlined high-throughput efficiency

Quality Control

  • • Perfectly consistent chemical-free results
  • • Zero residual surface staining
  • • Statistically proven higher die yields

Process Implementation

  • System Design: Customized piping and flow-rate for cleanrooms.
  • Continuous Monitoring: Real-time pH and ORP digital sensors.
  • Validation: High-stress performance verification sequences.

Future Applications

  • Advanced nanometer node manufacturing (<3nm)
  • Complex 3D vertical stacked packaging applications
  • Quantum computing device fabrication pipelines